| RoHS Statement |
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Hypertec RoHS Statement Under the RoHS and WEEE directives, any new electrical and electronic equipment must adhere to stringent standards for the following prohibited substances, Lead (Pb), Cadmium (Cd), Mercury (Hg), Hexavalent Chromium (Cr6+), Polybrominated biphenyl (PBB) and Polybrominated diphenyl ethers (PBDE). To date, Hypertec memory products' growing list of green components includes Lead-Free DRAM, Flash, electric resistors and capacitors, Controllers, EEPROM, and ICs, as well as Lead-Free & Halogen-Free PCBs and Lead-Free Solder Paste, Solder Bar and Solder Wire. As a responsible and concerned organisation, Hypertec has made best endeavours to ensure that products supplied by Hypertec meet all of the relevant standards for RoHS compliance and where product is sourced and distributed by Hypertec rather than manufactured, Hypertec has taken measures to ensure that suppliers of such products have also met the requirements of RoHS. As a consequence, Hypertec is happy to state that as of 1st July 2006, all products supplied by Hypertec, which fall within the realm of the RoHM directives, will be compliant. Some legacy module types may not be RoHS compliant due to RoHM components for these products being unavailable, and these products are rapidly becoming obsolete. |
