• Design

• Chassis type
• Tower

• Expansion slots

• PCI Express slots version
• 3.0

• PCI Express x16 (Gen 3.x) slots
• 2

• PCI Express x8 (Gen 3.x) slots
• 2

• Filters

• Machinecategory
• Server

• Graphics

• On-board graphics card
• Yes

• On-board graphics card model
• Matrox G200

• Memory

• Internal memory type
• DDR4-SDRAM

• Memory clock speed
• 2666 MHz

• Memory Installed
• 16 GB

• Memory layout (slots x size)
• 1 x 16 GB

• Memory Slot Support
• 768 GB

• Memory slots
• 12

• Network

• Cabling technology
• 10/100/1000Base-T(X)

• Ethernet LAN
• Yes

• Operational conditions

• Operating altitude
• 0 - 3048 m

• Operating relative humidity (H-H)
• 20 - 80%

• Operating temperature (T-T)
• 10 - 35 °C

• Storage relative humidity (H-H)
• 8 - 90%

• Storage temperature (T-T)
• -10 - 60 °C

• Other features

• Flash memory
• 2048 MB

• Performance

• Performance management
• XClarity Standard

• Trusted Platform Module (TPM)
• Yes

• Trusted Platform Module (TPM) version
• 1.2

• Ports & interfaces

• USB 2.0 ports quantity
• 3

• USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity
• 3

• VGA (D-Sub) ports quantity
• 1

• Power

• Number of main power supplies
• 1

• Power supply
• 550 W

• Power supply input frequency
• 50 - 60 Hz

• Redundant power supply (RPS) support
• Yes

• Processor

• Conflict-Free processor
• Yes

• ECC supported by processor
• Yes

• Embedded options available
• Yes

• Execute Disable Bit
• Yes

• Maximum internal memory supported by processor
• 768 GB

• Maximum number of PCI Express lanes
• 48

• Memory channels supported by processor
• Hepta

• Memory clock speeds supported by processor
• 2400 MHz

• Memory types supported by processor
• LPDDR4-SDRAM

• Number of Cores
• 8

• Number of processors installed
• 1

• Processor
• 4110

• Processor boost frequency
• 3 GHz

• Processor cache
• 11 MB

• Processor cache type
• L3

• Processor codename
• Skylake

• Processor family
• Intel® Xeon®

• Processor frequency
• 2.1 GHz

• Processor generation
• 1st Generation Intel® Xeon® Scalable

• Processor lithography
• 14 nm

• Processor manufacturer
• Intel

• Processor operating modes
• 64-bit

• Processor package size
• 76.0 x 56.5 mm

• Processor socket
• LGA 3647 (Socket P)

• Processor threads
• 16

• Scalability
• 2S

• Supported instruction sets
• AVX, AVX 2.0, AVX-512, SSE4.2

• Tcase
• 77 °C

• Thermal Design Power (TDP)
• 85 W

• Processor special features

• Enhanced Intel SpeedStep Technology
• Yes

• Intel 64
• Yes

• Intel Trusted Execution Technology
• Yes

• Intel TSX-NI
• Yes

• Intel TSX-NI version
• 1.00

• Intel Virtualization Technology (VT-x)
• Yes

• Intel Virtualization Technology for Directed I/O (VT-d)
• Yes

• Intel VT-x with Extended Page Tables (EPT)
• Yes

• Intel® AES New Instructions (Intel® AES-NI)
• Yes

• Intel® Hyper Threading Technology (Intel® HT Technology)
• Yes

• Intel® Turbo Boost Technology
• 2.0

• Processor ARK ID
• 123547

• Software

• Compatible operating systems
• Microsoft Windows Server 2016/2012 R2, Red Hat Enterprise Linux 7.3/6.9, SUSE, Linux Enterprise Server 12 SP2/11 SP4, VMware vSphere (ESXi) 6.5/6.0 U3

• Storage

• HDD interface
• Serial ATA, Serial Attached SCSI (SAS)

• Hot-Plug support
• Yes

• Hot-swap
• Yes

• Maximum storage capacity
• 61.44 TB

• Optical drive type
• DVD±RW

• RAID levels
• 0, 1, 5, 6, 10, 50, 60

• RAID support
• Yes

• Supported HDD sizes
• 2.5,3.5"

• Supported RAID controllers
• 930-8i

• Technical details

• Sustainability certificates
• ENERGY STAR

• Weight & dimensions

• Depth
• 666.4 mm

• Height
• 425.5 mm

• Width
• 175.8 mm